一枚芯片的生成，包括芯片设计、晶圆制造、封装测试三个环节。芯片的设计就处于芯片萌芽的前端。
ESDA6V1SC6
M24LR04E-RMN6T/2
LF120CDT-TR
M24LR04E-RDW6T/2
STM6510SCACDG6F
LM135Z
ST1S32PUR
VN7016AJTR
LM217MDT-TR
TDA7377
M24C64-FMC6TG
M95010-WMN6TP
L78M08ABDT-TR
L7812ABV
LM2901YDT
L78L12ABD-TR
LF33CV
L78M05CDT-TR
LF33ABDT-TR
SM2T3V3A
STBP120AVDK6F
LF33CDT-TR
DA112S1RL
HSP061-4M10
M95160-WMN6TP
VN7050AJTR
LSM6DS3TR
STLM20DD9F
LM317D2T-TR
STL8N6F7
LM135
MUN5211T1G
M24C02-FDW6TP
TS3431ILT
FDV303
STX616-AP
ESDA14V2L
ULN2003D1013TR
ST25DV04K-IER6T3
LM393PT
HSP061-2M6
STM809TWX6F
STM809SWX6F
STPS140A
LD2981ABM50TR
LF347DT
LMV822IDT
STD7NM80
SM6T200A
MC33078DT
LM335DT
LF253DT
ULN2004D1013TR
M95M01-RMN6TP
LMV358IDT
LM2903PT
LD3985M33R
LD1086D2M33TR
