26、SOI(small out-line I-leaded package)
I 形引脚小外型封装。表面贴装型封装之一。引脚从封装双侧引出向下呈I字形,中心距1.27mm。贴装占有面积小于SOP。日立公司在模拟IC(电机驱动用IC)中采用了此封装。引脚数26。
STPS0530Z
STPS10M60SF
STPS1230SF
STPS1545FP
L9825TR
ULN2002D1013TR
SM4T35CAY
TS391RILT
TSV734IPT
TSX3702IST
VN340SPTR-E
VN5025AJTR-E
VN5E050J-E
VN800PSTR-E
VND5025AK-E
VND5E025AKTR-E
VND600SPTR-E
VNP35NV04-E
VNQ5E160AKTR-E
ULN2069B
ULN2074B
VIPER06HN
VIPER26LN
VIPER35LD
VN340SP-33-E
VND7NV04-E
VNQ600PTR-E
X-NUCLEO-IKA01A1
SMC30J33CA
VN808CM-32-E
VN808CM-E
VN820SP-E
VNB35NV04-E
VND14NV04TR-E
STD15P6F6AG
STF11N65M2
STB36NM60N
STB33N60DM2
STDS75DS2F
STP7N65M2
STP12N60M2
STP220N6F7
STP23NM50N
STP7N60M2
STU12N60M2
STW13N60M2
STW20N65M5
STW35N60DM2
STW36NM60ND
STW56N60DM2
STW72N60DM2AG
STY105NM50N
TN1215-600H
STB18N65M5
STB24NM60N
STB28NM50N
STB30NF20L
STD105N10F7AG
STD11N60DM2
STD13N65M2
STD80N10F7
STF10N60DM2
STF11N60DM2
STF18N60DM2
TPS2051BDBVR
TPS65987DDHRSHR
LMR16006YQ3DDCTQ1
TLV1701QDBVRQ1
SN74LVC2G14DCKR
CSD18532Q5B
TPS3823-33DBVR
LM3478QMM/NOPB
SN3257QPWRQ1